Modeling and simulation of heat sinks for computer processors in COMSOL Multiphysics
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| Autores: | , , , , , , , |
|---|---|
| Formato: | artículo original |
| Estado: | Versión publicada |
| Fecha de Publicación: | 2012 |
| Descripción: | In this study, the heat transfer of three desktop- computer heat sinks was analyzed. The objective of using these heat sinks is to avoid overheating of the computer’s processing unit and in turn reduce the corresponding loss in the unit’s service time. The heat sinks were modeled using COMSOL Multiphysics with the actual dimensions of the devices, and heat generation was modeled with a point source. In the next step, the heat sink designs were modified to achieve a lower temperature in the higher temperature location on the heat sink. The results were temperature reductions in the range of 5-78 degrees Kelvin, by making feasible variations in design such as reducing the thickness of the heat exchanger fins and increasing their number. This paper demonstrates that there is room to develop improved designs that do not require more materials but rather a better engineering design. Initial work was done in the course CM-4101 Modeling and Simulation. |
| País: | RepositorioTEC |
| Institución: | Instituto Tecnológico de Costa Rica |
| Repositorio: | RepositorioTEC |
| Lenguaje: | Español |
| OAI Identifier: | oai:repositoriotec.tec.ac.cr:2238/4457 |
| Acceso en línea: | https://revistas.tec.ac.cr/index.php/tec_marcha/article/view/459 https://hdl.handle.net/2238/4457 |
| Access Level: | acceso abierto |
| Palabra clave: | Heattransfer; heatsink; modeling; simulation; finite elements. Transferencia de calor; disipador de calor; modelización; simulación; elementos finitos. |