Modeling and simulation of heat sinks for computer processors in COMSOL Multiphysics
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| Nhiều tác giả: | , , , , , , , |
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| Định dạng: | artículo original |
| Trạng thái: | Versión publicada |
| Ngày xuất bản: | 2012 |
| Miêu tả: | In this study, the heat transfer of three desktop- computer heat sinks was analyzed. The objective of using these heat sinks is to avoid overheating of the computer’s processing unit and in turn reduce the corresponding loss in the unit’s service time. The heat sinks were modeled using COMSOL Multiphysics with the actual dimensions of the devices, and heat generation was modeled with a point source. In the next step, the heat sink designs were modified to achieve a lower temperature in the higher temperature location on the heat sink. The results were temperature reductions in the range of 5-78 degrees Kelvin, by making feasible variations in design such as reducing the thickness of the heat exchanger fins and increasing their number. This paper demonstrates that there is room to develop improved designs that do not require more materials but rather a better engineering design. Initial work was done in the course CM-4101 Modeling and Simulation. |
| Quốc gia: | Portal de Revistas TEC |
| Tổ chức giáo dục: | Instituto Tecnológico de Costa Rica |
| Repositorio: | Portal de Revistas TEC |
| Ngôn ngữ: | Español |
| OAI Identifier: | oai:ojs.pkp.sfu.ca:article/459 |
| Truy cập trực tuyến: | https://revistas.tec.ac.cr/index.php/tec_marcha/article/view/459 |
| Từ khóa: | Heattransfer heatsink modeling simulation finite elements. Transferencia de calor disipador de calor modelización simulación elementos finitos. |