Characterization of the Thermal Interface Material (TIM) of a microprocessor
محفوظ في:
| المؤلف: | |
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| التنسيق: | artículo original |
| الحالة: | Versión publicada |
| تاريخ النشر: | 2013 |
| الوصف: | Thermal Interface Materials (TIM) are materials which are used in microelectronics, mainly in microprocessors, to improve the yield of heat transfer between the silicon die and the copper heat sink, replacing the trapped air in this area due to the surface roughness of both components. The heat transfer in this material depends mostly of its chemical composition and its thickness. This work deals with the measure of thickness and the determination of chemical composition for the TIM of an Intel Pentium 4 microprocessor, using a scanning electron microscope (SEM) equipped with energydispersive x-ray spectrometer (EDX), present in the Nanotechnology Laboratory of the ITCR. |
| البلد: | Portal de Revistas TEC |
| المؤسسة: | Instituto Tecnológico de Costa Rica |
| Repositorio: | Portal de Revistas TEC |
| اللغة: | Español |
| OAI Identifier: | oai:ojs.pkp.sfu.ca:article/1579 |
| الوصول للمادة أونلاين: | https://revistas.tec.ac.cr/index.php/tec_marcha/article/view/1579 |
| كلمة مفتاحية: | Material de Interfaz Térmica microprocesador SEM EDX. Thermal Interface Material Microprocessor |