Characterization of the Thermal Interface Material (TIM) of a microprocessor
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| Autor: | |
|---|---|
| Médium: | artículo original |
| Stav: | Versión publicada |
| Datum vydání: | 2013 |
| Popis: | Thermal Interface Materials (TIM) are materials which are used in microelectronics, mainly in microprocessors, to improve the yield of heat transfer between the silicon die and the copper heat sink, replacing the trapped air in this area due to the surface roughness of both components. The heat transfer in this material depends mostly of its chemical composition and its thickness. This work deals with the measure of thickness and the determination of chemical composition for the TIM of an Intel Pentium 4 microprocessor, using a scanning electron microscope (SEM) equipped with energydispersive x-ray spectrometer (EDX), present in the Nanotechnology Laboratory of the ITCR. |
| Země: | Portal de Revistas TEC |
| Instituce: | Instituto Tecnológico de Costa Rica |
| Repositorio: | Portal de Revistas TEC |
| Jazyk: | Español |
| OAI Identifier: | oai:ojs.pkp.sfu.ca:article/1579 |
| On-line přístup: | https://revistas.tec.ac.cr/index.php/tec_marcha/article/view/1579 |
| Klíčové slovo: | Material de Interfaz Térmica microprocesador SEM EDX. Thermal Interface Material Microprocessor |